Zhongjing Science Instrument Cutting Silicon Wafers

$90.61

Número do item:MA-CM-OT-000201

Especificações

✓ Selecionado: Medium mirror cutting silicon 10*10mm，10 pieces/bag

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Detalhes

The cutting silicon wafers from Canrd are developed as high-precision substrate materials for advanced sample characterization in SEM, AFM, X-ray analysis, and electron probe microscopy. Available in three standard sizes (5×5 mm, 10×10 mm, and 20×20 mm, each packaged as 10 pieces per bag), these mirror-polished wafers provide a reliable and consistent base for thin-film deposition and material growth studies. Their surface quality and dimensional accuracy directly influence subsequent characterization outcomes, making substrate selection critical for experimental reproducibility. These consumables are designed for laboratories requiring clean, ready-to-use silicon substrates with minimal variation.

Precautions for cutting silicon wafers：This product is a consumable, so once opened and confirmed to be in good condition, it cannot be replaced if there are no quality issues. Please carefully check the quantity and specifications of the product within one week of receiving it to ensure they match the documents. If there is any discrepancy, please provide feedback to customer service for assistance. Returns or exchanges will not be accepted after one week (except for quality issues).

Zhongjing Science Instrument's substrate material series provides various types of substrates for sample characterization in equipment such as SEM, AFM, X-ray analysis, and electronic probe microscopes. With the improvement of various preparation methods, the characteristics of the substrate material will greatly affect the material's growth process. The unique properties of the substrate material (such as optical, electrical, magnetic, etc.) will also affect the characterization of the sample. Therefore, the proper selection of the substrate is of great significance to the sample preparation process and characterization results.