Zhongjing Keyi TEM Copper Grids with Thick Carbon Support Film (200-400 Mesh, 100 Pieces)

Name: Zhongjing Keyi TEM Copper Grids with Thick Carbon Support Film (200-400 Mesh, 100 Pieces)
Brand: Canrd
Price: 217.47 USD
Availability: InStock

$217.47

Numéro d'article:MA-CM-OT-000101

Spécifications

✓ Sélectionné: 230 mesh

Quantité

Assurance qualité

Vente directe usine

Livraison mondiale

Details

Aperçu

Détails

This product is a copper grid reinforced carbon film designed for high-resolution transmission electron microscopy (TEM) applications. It features a thick carbon support film stabilized with a Formvar layer, achieving a total film thickness of 20–40 nm. This construction is specifically developed to withstand the intense electron beams of 200 kV and 300 kV microscopes, where the enhanced carbon thickness minimizes beam-induced damage to both the sample and the support film. Suitable for observing the morphology of nanomaterials, the grids are available in multiple mesh sizes (200 to 400 mesh) and are supplied in packs of 100 pieces. This product is commonly employed in advanced materials research and battery science, providing reliable support under high-energy imaging conditions.

EMCN Formvar Support Film Stabilized with Thick Carbon

Thick Carbon Support Film (abbreviated as: Thick Carbon Film). Structure: Thick Carbon Film + Formvar Film + Support Grid. The Thick Carbon Support Film is a product characterized by a greater thickness compared to standard carbon support films. It is primarily utilized for observing the morphology of nanomaterials under transmission electron microscopes (TEM) operating at 200 kV or 300 kV. Since the electron beams in microscopes operating above 200 kV possess strong penetration capabilities, they also inflict a greater degree of damage upon both the sample and the support film. This is particularly critical at 300 kV, where a thicker carbon layer is required to mitigate the damage to the sample caused by the high-intensity electron beam. Total film thickness: 20–40 nm.