This product is an indium sheet developed for scientific research applications, particularly within advanced materials and energy-related studies. With a purity of 99.995% and a soft, silvery-white metallic appearance, it offers reliable chemical stability and a clean, oxidation-free surface. Its low melting point of 156.6 °C, combined with a thermal conductivity of 0.818 W/cm·K and a resistivity of 8.37 Ω·m at 20 °C, makes it well-suited for use in vacuum deposition, semiconductor contact layers, low-temperature soldering, and as a conductive adhesive interface in battery or energy device assembly. The material is available in multiple thicknesses, all on a 100×100 mm substrate, offering flexibility for experimental design. Its high density of 7.31 g/cm³ and consistent thermal expansion properties further support its utility in precision research environments where reproducible performance is critical.

Note: The above specifications are custom-made; returns or exchanges are not accepted unless due to a quality issue.

Density: 7.31 g/cm³ at 25°C
Melting Point: 156.6 °C
Boiling Point: 2080 °C
Coefficient of Thermal Expansion: (25°C) 32.1 µm·m⁻¹·K⁻¹
Thermal Conductivity: 0.818 W/cm/K at 298.2 K
Resistivity: 8.37 Ω·m at 20 °C
Purity: 99.995%